Nevuli provides embedded engineering and EU-based electronics manufacturing. Choose a single module or the full path from concept to production.
- Embedded systems R&D – requirements, architecture, firmware (MCU or embedded Linux)
- Electronics design – schematics, PCB layout, mixed-signal and power design
- Prototyping and validation – rapid builds, functional checks, pre-compliance screening (as applicable)
- Industrialisation and NPI – BoM optimisation, DFM/DFT reviews, test strategy and planning
- Material-aware industrialisation – selection and documentation of metallic, polymeric, composite and ceramic-functional components used in electronic assemblies, enclosures, sealing, thermal management, coatings and box-build integration.
- Manufacturing and integration – SMT/THT assembly, inspection (AOI/X-ray as applicable), box build
- Test engineering – test fixtures, automated functional test, ICT/boundary-scan where applicable
- Security engineering – secure boot, signed firmware, device identity, secure update paths (OTA where applicable)
- Lifecycle and after-sales – repairs, fault isolation and root-cause analysis, obsolescence management
Material-aware product industrialisation
Nevuli supports the selection, integration and validation of material components used in electronic products. Our engineering and manufacturing workflows consider the interaction between electronics, enclosure materials, thermal behaviour, sealing, mounting, repairability, traceability and long-term reliability.
Typical material groups include:
- Metals: conductive paths, contacts, connectors, shielding, mounting parts and heat-spreading elements.
- Polymers: enclosures, cable insulation, labels, coatings, potting, sealing and protective components.
- Composites: PCB substrates, reinforced polymer parts and structural elements used in electronic assemblies.
- Ceramics: ceramic capacitors, ceramic-filled thermal interface materials and other ceramic-functional components where required by the product design.
This supports BoM optimisation, design-for-manufacturing, material traceability, circularity assessment and robust box-build integration.