Do your builds scale consistently? EU‑based SMT and THT assembly with AOI and X‑ray, selective soldering and box build – all with serialisation, traceability and documented quality.
Capabilities
- SMT and THT assembly including fine‑pitch and BGA
- Reflow and selective soldering, conformal coating and potting
- AOI on 100 percent of boards and X‑ray for hidden joints
- Box build, cable harnessing, labelling and packaging
Quality and traceability
- Workmanship to IPC‑A‑610 classes as required
- Unit serialisation with MES‑supported data capture
- Controlled firmware releases and device provisioning
Test and validation
- ICT, flying‑probe and automated functional test stations
- Calibration, burn‑in where appropriate, result databases and reports
- Certificates of conformity and production data packs
Delivery models
- Pilot builds and ramp to series
- Build‑to‑order or configure‑to‑order with agreed lead times
- Spares, repair and failure analysis with corrective actions
Benefits
- Consistent quality at scale with measurable outcomes
- Full visibility of test results and unit history
- Shorter time from order to shipment