Assembly and box build
SMT and through-hole assembly, including fine-pitch and BGA, connects with reflow, selective soldering, coating, potting, harnessing and packaging.
Inspection and verification
The manufacturing approach includes automated optical inspection and X-ray for hidden joints, with suitable in-circuit, flying-probe and functional testing. Calibration and burn-in are applied where appropriate.
Traceable delivery
Unit serialisation, controlled firmware releases and provisioning link products to test results and production documentation. Workmanship requirements are agreed for each build.
From pilot to lifecycle support
Pilot builds lead into series delivery, with build-to-order or configured variants and agreed lead times. Spares, repair and failure analysis support the product lifecycle.
Material records
Relevant enclosure, substrate, coating, sealing, mounting and thermal-management information can be connected to each product’s records.